News Release

TOYOBO MC Corporation (hereinafter, “TOYOBO MC”) will exhibit at “5th NEPCON JAPAN [September]”, to be held at Makuhari Messe from September 9 to 11 , 2026. The exhibition brings together cutting-edge electronic components, materials, manufacturing equipment, assembly systems, and inspection technologies that support the increasing functionality and performance of electronic devices.

Press Release

At its booth, TOYOBO MC will showcase for the first time its newly developed “VYLOSHOT^® “, a halogen-free flame-retardant low-pressure encapsulation molding material.

“VYLOSHOT^®” is a low-pressure encapsulation molding material designed to protect printed circuit boards and electronic components. Its excellent flowability enables molding at low pressure, minimizing stress on delicate electronic parts. Flame retardancy is an essential requirement for encapsulation materials. However, conventional halogen-based flame retardants have raised concerns because they may generate toxic gases during combustion. To address the growing demand for halogen-free flame-retardant materials, particularly in Europe, TOYOBO MC has developed a new grade. In addition to flame retardancy, the new grade provides the durability and adhesion required for encapsulation applications.

Through this exhibition, TOYOBO MC aims to further expand its business in the electrical and electronic materials market, one of its strategic growth areas. We look forward to welcoming you to our booth.

1.Products
・VYLOSHOT ® (Low-pressure encapsulation molding material)
・VYLOSHOT ®, a halogen-free flame-retardant grade (newly developed product)

2．About the Exhibition
・Duration：September 9－11 , 2026　10:00－17:00
・Venue：Makuhari Messe, Japan
・Booth No.：A9-30
・Exhibition website：NEPCON JAPAN

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The information presented in this news release is accurate as of the date of its announcement. Please be advised that the content may be subject to change without prior notice following the release date.